IPC-2225(EnglishVersion)IntroductionIPC-2225isastandarddevelopedbytheAssociationConnectingElectronicsIndustries(IPC)thatprovidesguidelinesforthedesignoforganicprintedboardsandotherformsofcomponentmountingandinterconnectingstructures.Specifically,thisstandardfocusesontherequirementsandconsiderationsforhigh-densityinterconnect(HDI)andmicroviatechnologyinprintedcircuitboard(PCB)design.Thedocumentcoverskeyaspectssuchasmaterialselection,designrules,fabricationprocesses,andreliabilitytestingforHDI/microviastructures.ItservesasacriticalreferenceforPCBdesigners,manufacturers,andengineerstoensureoptimalperformance,manufacturability,andreliabilityinadvancedelectronicpackagingapplications.IPC-2225iswidelyusedinindustriesrequiringhigh-performancePCBs,includingaerospace,automotive,telecommunications,andconsumerelectronics.CompliancewiththisstandardhelpsachieveconsistentqualityandinteroperabilityincomplexPCBdesigns.Fordetailedtechnicalspecifications,alwaysrefertotheofficialIPC-2225document.
