IPC-2223istheindustrystandardforthedesignandqualificationofrigidprintedboardswithembeddedpassivedevices.PublishedbyIPC(AssociationConnectingElectronicsIndustries),thisdocumentprovidesguidelinesformaterials,designconsiderations,fabricationprocesses,andtestingmethodsspecifictorigidPCBscontainingembeddedpassivecomponents.Thestandardcoverskeyaspectssuchasmaterialselection,electricalperformancerequirements,thermalmanagement,andreliabilitytestingtoensureconsistentqualityandperformanceofembeddedpassivetechnology.Itservesasacriticalreferencefordesigners,manufacturers,andqualityassuranceprofessionalsworkingwithadvancedPCBtechnologiesthatintegratepassiveelements(e.g.,resistors,capacitors)directlyintotheboardstructure.ByadheringtoIPC-2223,stakeholderscanimprovemanufacturability,reducedevelopmentrisks,andenhancethereliabilityofrigidPCBswithembeddedpassivesinapplicationsrangingfromconsumerelectronicstoaerospacesystems.
