IPC-4761isastandardpublishedbytheAssociationConnectingElectronicsIndustries(IPC)thatprovidesguidelinesforthedesignanduseofviafillandpluggingmaterialsinprintedcircuitboards(PCBs).Thestandardfocusesontherequirementsforfillingandpluggingviastoensurereliability,performance,andmanufacturabilityofPCBs.KeyaspectscoveredinIPC-4761include:-Definitionsofdifferenttypesofviafillandpluggingprocesses.-Materialrequirementsforviafill,includingconductiveandnon-conductiveoptions.-Inspectionandacceptancecriteriaforfilledvias.-Reliabilitytestingmethodstoensurelong-termperformance.ThestandardiswidelyusedintheelectronicsindustrytoimprovePCBquality,particularlyinhigh-densityinterconnect(HDI)designs,whereviafillingiscriticalforsignalintegrityandthermalmanagement.CompliancewithIPC-4761helpsmanufacturersachieveconsistentandreliableviapluggingresults.Fordetailedspecifications,usersshouldrefertothefullIPC-4761document.
