TheIPC-2226standard,titled"SectionalDesignStandardforHighDensityInterconnect(HDI)PrintedBoards,"providescomprehensiveguidelinesforthedesignofhigh-densityinterconnectprintedcircuitboards(PCBs).ThisstandardispartoftheIPC-2220series,whichcoversvariousaspectsofPCBdesign.IPC-2226specificallyaddressestheuniquechallengesandrequirementsassociatedwithHDItechnology,includingmicrovias,fine-linefeatures,andadvancedlayerstackingtechniques.Itoutlinesdesignconsiderationsformaterials,fabricationprocesses,andelectricalperformancetoensurereliabilityandmanufacturabilityofHDIPCBs.KeytopicscoveredinIPC-2226include:-Microviadesignandreliability-Sequentiallaminationtechniques-High-densityroutingandspacingrules-MaterialselectionforHDIapplications-ThermalmanagementandsignalintegrityconsiderationsThisstandardservesasanessentialreferenceforPCBdesigners,engineers,andmanufacturersworkingwithhigh-densityinterconnecttechnology,helpingtooptimizeperformancewhilemeetingindustryqualityandreliabilitystandards.
